LowBoard 22 – OMNIE Underfloor Heating, Heat Pumps & Ventilation
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LowBoard 22
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LowBoard 22

DS UFH 02.2

Introduction

LowBoard22 is a non structural, 22mm thick, tongue and grooved, chipboard underfloor heating panel that is floated or mechanically fixed over a flat and even timber or solid sub floor. The low panel height makes it suitable where there is not enough floor-to-ceiling height to install a conventional underfloor heating system.

The panel has a multi-directional design for ease of installation. The universal panel is simply laid across the floor with no loop ends and straights to configure. The pipe pierces the foil diffuser as it is pressed into the channels, before a finished floor deck, 6mm flooring grade ply, MDF or similar is mechanically fixed over the LowBoard panels to complete the floor.


Specification

OMNIE LowBoard system using 12mm PE-RT pipe to DIN 4726.

The 22mm LowBoard panels to be laid fully floating with all tongue and grooves fully glued to form a continuous layer over a flat & even sub-floor. Next a minimum of 6mm covering layer such as flooring grade ply is then mechanically fixed over the LowBoard panels. If timber or laminate is used there is no need for a covering layer on top of LowBoard.

For tile & decorative vinyl floor finishes the LowBoard panels will require fixing to screed or a deflection free timber floor with all tongue and grooves fully glued with a minimum 6mm flooring grade ply or tile backerboard mechanically fixed over.

The system is to be designed, installed and commissioned to BS1264.

ULTRALOW – This product has reduced build up compared to other available systems. For more information on UltraLow Technology see DS UFH 23

LAYFAST – Speed up installation time. This product uses our multi-directional pipe channel system.
For more information see DS UFH 22

DRYSYSTEM – No wet trades required, designed for dry constructions.
For more information see DS UFH 24


Technical Details

LowBoard 22 panel
P5 grade tongue and groove chipboard (TG2 OR TG4) with integrated diffuser

Thermal conductivity (22mm chipboard)
0.12 W/mK   (R value = 0.18 m²K/W)

Panel Thickness
22mm

Panel Dimensions
2400 x 600mm

Weight with water
18.9kg/m² (with 6mm ply)

Pipe
12mm PE-RT to DIN 4726

Pipe Centres
150mm

Existing Slab/Floor Deck
Existing slab/floor deck to meet at least SR2 (5mm deviation in 2m) requirements for floor regularity (BS8204) and preferably SR1 (3mm deviation in 2m). The floor finish company may have their own requirements which take precedence.

Heat Output

Heat outputs below are based on:

12mm PE-RT pipe at 150mm centres

Air Temperature = 20°C

Where required a non structural covering layer (by others)

(0.15 m²K/W = 1.5 TOG)

Heat outputs are dependent on the water temperature, floor construction, system dimensions, floor finish & design conditions. Please call 01392 36 36 05 to discuss your specific requirements.

Covering Layer & Floor Finish55/48 (°C)50/43 (°C)45/38 (°C)40/33 (°C)
6mm floor grade Plywood – Tile Finish (0.01m²K/W)91 W/m²77 W/m²62 W/m²47 W/m²
15mm Timber/Laminate – direct finish (0.1m²K/W)80 W/m²68 W/m²55 W/m²42 W/m²
22mm Timber – direct finish (0.16m²K/W) 71 W/m²60 W/m²49 W/m²37 W/m²
6mm floor grade Plywood – Carpet & Underlay (0.15 m²K/W) Carpet & Underlay (0.15 m²K/W) 65 W/m²55 W/m²44 W/m²34 W/m²

Related Documents

  • DS UFH 24 DrySystem Technology System
  • DS UFH 23 UltraLow Technology System
  • DS UFH 22 LayFast Technology System
  • IG UFH 02.1 LowBoard 22 Install Guide
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